piras77 wrote: ↑Thu Nov 02, 2017 12:35 pm
Is there some reference for this? It appears to me quite a bit too little. The resulting dissipation would be approx. something about 25mW (at dU 500mV),
On what basis is that too little other than you want to draw bigger currents?
25mW on a device that is consuming <1W (*) is 2.5% just on driving your GPIOs rather than doing any processing. What a waste.
piras77 wrote:And, even though it is no contradiction, why did you write: "If you load each pin with 16mA the total current is 272mA. The 3V3 supply will collapse under that!" if 50mA are already the limit?
I suspect the 50mA isn't a hard limit enforced in the hardware, it's the point where you'll be creating issues.
Within the SoC you're routing power from balls underneath to each block. How big do you make the power rails in each case? If you want 200mA you have to put the copper in there to carry it, and that costs (mainly in area).
Also the power supply has to be able to supply that much current at that particular voltage. The headroom on the 3.3V SMPS within the BCM2835 isn't huge, hence why Gert says the 3V3 power rail will collapse. There is some more headroom on the Pi2 and Pi3 as they use an external SMPS, but it still isn't 100's mA.
Seeing as Gert was one of the hardware engineers who designed this chip, take what he says as sound engineering advice based on the design decisions made for the SoC.
(*) approx the original design power dissipation - IIRC the full camcorder use case was around 700mW.
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