rock1348
Posts: 1
Joined: Thu Jul 19, 2018 12:12 am

Compute Module 3 Thermal Information

Thu Jul 19, 2018 12:19 am

I am currently working on a project with the compute module that involves large amounts of CPU usage, as such the BCM2837 on the Compute Module gets very hot to the point where the SoC starts throttling itself.
I've tried searching for specific thermal information for this SoC including making inquiries to Broadcom but have come up empty handed. Is there any information on the specific junction-case thermal resistance for the SoC so I can properly do a thermal design on a heat-sink.

John Westlake
Posts: 84
Joined: Thu Nov 09, 2017 4:34 am

Re: Compute Module 3 Thermal Information

Sun Jul 29, 2018 11:27 pm

I asked the question awhile back about the specific junction-case thermal resistance for the BCM2837 but sadly got no reply :(

gsh
Raspberry Pi Engineer & Forum Moderator
Raspberry Pi Engineer & Forum Moderator
Posts: 1347
Joined: Sat Sep 10, 2011 11:43 am

Re: Compute Module 3 Thermal Information

Mon Jul 30, 2018 10:06 am

We're still writing up results
--
Gordon Hollingworth PhD
Raspberry Pi - Director of Software Engineering

John Westlake
Posts: 84
Joined: Thu Nov 09, 2017 4:34 am

Re: Compute Module 3 Thermal Information

Mon Jul 30, 2018 2:50 pm

gsh wrote:
Mon Jul 30, 2018 10:06 am
We're still writing up results
Thank you for the update.

douglas5962
Posts: 19
Joined: Thu Mar 29, 2018 2:22 pm

Re: Compute Module 3 Thermal Information

Mon Jul 30, 2018 7:04 pm

Just to throw it out there, my company is also designing a heatsink for the CM3 as we're seeing thermal management issues as well.

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