Is it advisable to have solder holes beneath where the CM3 is mounted?
For example, I want to solder some wires to some holes on the space below the module so that I don't waste all that space.
I'm using a 1473149 SODIMM connector which states the module height (the center of the compute board) is at 3.4mm.
The datasheet for the CM says max component height on the back of the CM is 1.5mm. Board thickness is 1.0mm.
Does that mean I take 3.4 module height - half the PCB thickness of .5mm minus max object height 1.5mm and get 1.4mm?
Regardless of how the math ends up, I still would like to hear generally if it's advisable.