Yes, that looks the same as the one I've got.pcmanbob wrote: ↑Thu May 23, 2019 12:38 pmThis is the one I use now , have tried many over the years including a semi professional de-soldering station, but I have found this works well with all sizes of component/solder pads,
soft silicone tip allows you to get a good seal around the component lead and the soldering iron so as to remove as much solder in one go as possible.
https://www.amazon.co.uk/Quality-Innova ... way&sr=8-1
A silicone-tip solder sucker is my preferred method for getting through-hole component leads out from multilayer PCBs, especially if the pads are bonded to multiple layers. The silicone tip doesn't degrade at solder melting temperatures (they're good up to 250C usually) and the squishiness means that they make an airtight seal around the pad. Chop the component off with angle cutters, heat the joint and lead stub, suck the stub and the solder out through the PCB via the sucker.rpdom wrote: ↑Thu May 23, 2019 12:27 pmThe solder sucker I currently use (I have tried a few different ones) has a flexible silicone pipe for the nozzle. Because it is soft it doesn't transfer the force of the pump onto the component that is being desoldered. It comes with a couple of pieces of the silicone tube that can be cut to length to use as nozzles when the old ones wear out.
There is also that (slightly expensive) stuff that is essentially a very low melting point solder-type alloy (about 60°C) that can be used to keep solder on SMT chips molten for long enough that you can just run a soldering iron around the chip and lift it off. It needs to be cleaned off the pads before putting on a new component, but as it stays liquid for longer it is easy to wipe off.jdb wrote: ↑Thu May 23, 2019 7:10 pmDesolder braid is infinitely superior for surface mount pads, especially when manually soldering. Just cover the whole row of pads in solder, make sure it all flows cleanly, then hoover off the excess with the braid. Because the braid has nothing other than capillary action to remove solder, the bond between component lead and surface pad isn't going to go dry. Braid also works for cleaning up pads prior to replacing a component - because it wicks solder away from a surface, it leaves the surface almost completely flat so your SMT component won't ride up on bumps.