BCM2835 and BCM2837 made in 28nm?
Faster, lower power Zeros and 3's = Zero+ and Pi4?
Smaller die = cheaper chips?
Do the BCM2835/37 need to be redesigned for 28nm?
How does a die shrink work?
What is involved?
If the yield is similar then more cpu's per wafer = more Pi's.
28nm parts would/should mean Pi's can be overclocked compared to existing chips.
A few more years of life before BCM2838 needs to be made?
Broadcom has had access to 28nm process since 2012?
No idea how they do masks these days, still UV lithographic
TSMC the foundry? NEC Kyushu?
More than one foundry?
Which foundry's still do 40nm or still want to do 40nm?
RPF buys own foundry to keep supply chain filled
Die shrinks do seem to make sense for 2018 than new BCM2838.
More and faster Pi chips, everything else except maybe regulator stays the same.
28nm needs lower voltage? Zero's are overclocked by boosting voltage?
28nm parts could have been done by now, so 28th Feb 2018 could see that announcement.
Now we just speculate about clock speeds, 1.5GHz for BCM2835A, 2GHz for BCM2837A?
3 weeks to wait?
Can I place orders now
I'm dancing on Rainbows.
Raspberries are not Apples or Oranges