The battle between copper and aluminium as heatsink material is always going big. Thermal conductivity of copper is better, true. But W/m*K / buck of aluminium is better.tufty wrote:Cu is a better heatsink material than Al, but it's probably gonna be surface area that limits performance for a sink of this size rather than materials.guidol wrote:I think copper would cool down the raspberry better than aluminium
That said, anything is better than nothing.
From WikipediaLob0426 wrote:... And I don't think a diamond is that good of conductor anyway.
Why didn't you apply thermal paste? It wouldn't cool it if you don't have the paste on.sharix wrote:Here's mine, no thermal paste
Technically, it wouldn't cool as effectively without paste. While a good thermal paste will aid in the transfer of heat from the chip to the sink, the main function by which it does this is by remove any air gaps caused by not having two perfectly smooth surfaces to affix to one another (less air gaps = higher contact of surface area = faster heat dissipation)ryandigweed wrote:Why didn't you apply thermal paste? It wouldn't cool it if you don't have the paste on.sharix wrote:Here's mine, no thermal paste
A friend of mine cut up his CHipset Heatsinks, and stuck them onto the cpu , ram and ethernet chip of the pie, using adhesive thermal pads
Here is my Copper-Version with the Cooltek VGA-Ram Cooler:Burngate wrote: Copper: Thermal conductivity 401 W·m−1·K−1
Aluminium: Thermal conductivity 237 W·m−1·K−1
That's nothing! Check out this http://www.raspberrypi.org/phpBB3/viewt ... 32#p102932ryandigweed wrote:Wow, not used to seeing copper heatsinks !: D
Saw that one !:D i like the idea, but i don't know, doesn't seem so practical to me It's a fun mod, but i would preffer a normal fanAndrewS wrote:That's nothing! Check out this http://www.raspberrypi.org/phpBB3/viewt ... 32#p102932ryandigweed wrote:Wow, not used to seeing copper heatsinks !: D
I used Artic Silver on my first set. They slid all over the place. They got a little firmer over time, but not much. these ones have thermal tape and are working fine.sduskin wrote:Cu is slightly better than Al in this environment as heat sink material. I would use arctic silver rs or arctic silver 5 as the thermal compound. Using a fan to improve convection heat dissipation would also work and prevent the (potentially) permanent mod to the RaspPi. If I remember correctly, the Model B needs at least 700ma. Adding a wireless dongle will need an additional 200ma or more unless the extra dongles are attached via a powered USB hub. Without the extra juice any wifi could potentially act a bit flakey at times.
Sorry if this post rambles a bit, but I was trying to cover the comments of more than a few other posts.
Obviously Liquid Nitrogen is well below the specified operating temperature of ANY of the components on the board.mahjongg wrote:If you go that way, why not go all the way, and submerge the board in liquid nitrogen while you are at it.