A few days ago, we pushed out some more documentation for the forthcoming Compute Module and Compute Module IO Board, which together make up the Compute Module Development Kit. This new documentation covers power supply and sequencing requirements, temperature limits, and the process for writing an operating system image onto a module; and provides a summary of the various interfaces available on the module edge connector. Between now and the launch of the Development Kit, we’ll be releasing the CAD files for the IO Board so you’ll have something on which to base your own Compute Module projects – keep your eyes out for more.
The Compute Module and Compute Module IO Board were designed using Cadence PCB Editor. In this video, James talks with Simon Wood from Parallel Systems about his experiences designing high-tech PCBs with these tools.